Figure 3.
An example of ELF-MF exposure pattern of several semiconductor workers (solid black line: operator, OP; dotted grey line: maintenance engineer, ME). (a) Diffusion worker in fabrication (arithmetic mean, AM: OP = 1.93 µT, ME = 0.78 µT); (b) Thin-film worker in fabrication (AM: OP = 1.14 µT, ME = 0.34 µT); (c) Die-attach worker in package and test (AM: OP = 0.72 µT, ME = 0.22 µT); (d) Chip-mount worker in package and test (AM: OP = 1.75 µT, ME = 0.47 µT).
