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. 2018 May 3;8:6971. doi: 10.1038/s41598-018-25202-4

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© The Author(s) 2018

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Capillarity-assisted adhesive bonding. (a) Schematic of the adhesive delivery method. The adhesive mix is injected into the interstitial space between the chip and the substrate, and capillarity forces drive the flow of the adhesive throughout the bonding surfaces without flooding the channels. (b–e) PMMA microfluidic devices adhesively-bonded via capillarity-assisted adhesive delivery on PMMA (b) glass (c) silicon (d) and LiNbO₃ (e) substrates. Scale bar: 1 cm.