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. 2018 May 3;8:6971. doi: 10.1038/s41598-018-25202-4

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© The Author(s) 2018

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Characterisation of the adhesive bond. Transverse section PMMA chips bonded to PMMA (a) and glass (b) substrates analysed by scanning electron microscopy. A thin layer of adhesive can be observed at the interface between the two materials (black arrows). An accumulation of adhesive at the edges of the channel, resulting in an oval cross-section, can also be observed (white arrows). Scale bar: 200 μm. (c) Detail of the accumulation of adhesive at the edges of the channel in a PMMA-Glass substrate. Scale bar: 100 μm. (d) Bond shear strength for PMMA-to-PMMA adhesive bonding via capillarity-assisted adhesive delivery. Samples were allowed to cure for 72 hours or 2 months (aged) before tensile testing. **p < 0.01 (Mean ± SD, n = 3).