Figure 3.

Details of fracture planes following mechanical testing of aGC and thin-film metal (Pt) probes. (a) SEM image highlighting failure plane in probes with metal interconnects where numerous micro-cracks were developed prior to and at time of failure. (b) SEM image of failure plane in aGC probes. Apart from the failure plane, a single crack is observed at failure while the rest of GC interconnects remain intact. This micro-crack extends through the width of the specimen consistent with cracks that form during failure of homogeneous materials.