Table 1.
Mechanical Performance Results for Thiol-Michael and BisGMA/TEGDMA Systems.
| Resin System | Tg, °C | Young’s Modulus, GPa | Flexural Strength, MPa | Toughness, J·m-3 |
|---|---|---|---|---|
| BisGMA/TEGDMA | 169 (10) | 3.1 (1.3) | 66 (25) | 1.2 (0.8) |
| PETMP/DVS | 47 (2) | 0.63 (0.2) | 24 (6) | 1.8 (0.5) |
| PETMP/SR368 | 53 (1) | 0.03 (0.02) | 4.3 (1.9) | 0.31 (0.16) |
| SiTSH/DVS | 79 (3) | 1.9 (0.1) | 66 (2) | 5.1 (0.6) |
| SiTSH/SR368 | 53 (2) | 0.20 (0.01) | 6.0 (1.5) | 0.49 (0.09) |
Systems were cured with 2 wt% NPPOC-TMG and 100 mW/cm2 of 320 to 390 nm at ambient temperature. Values are presented as mean (SD). Samples for water absorption were postcured in 70 ºC overnight. See Appendix Figure 3 for the dynamic mechanical analysis plots for thiol-Michael systems.
BisGMA/TEGDMA, 2,2-bis[p-(3-methacryloxy-2-hydroxypropoxy) phenyl]propane / triethylene glycol dimethacrylate; DVS, divinyl sulfone; NPPOC-TMG, 2-(2-nitrophenyl)-propyloxycarbonyl-1,1,3,3-tetramethylguanidine; PETMP, pentaerythritol tetra(3-mercaptopropionate); SiTSH, silane thiol; SR368, tris(2-hydroxyethyl)isocyanurate triacrylate; Tg, glass transition temperature.