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. Author manuscript; available in PMC: 2018 May 22.
Published in final edited form as: Chem Rev. 2017 Jan 19;117(3):2059–2107. doi: 10.1021/acs.chemrev.6b00636

Table 3.

Selected Kinetic Parameters for the Formation of 1:1 Cu:O2 Adducts

ligand (solvent) kon (M−1 s−1) ΔHon (kcal mol−1) ΔSon (cal mol−1 K−1) koff (M−1 s−1) ΔHoff (kcal mol−1) ΔSoff (Cal mol−1 K−1) ref
L2d (THF) (1.560 ± 0.019) × 103a 4.3 ± 0.5 −23.9 ± 2.4 151
L23a (acetone) 4.1 × 107b −1.6 ± 0.2 −31 ± 1 2.4 × 10−2b 10.5 ± 0.5 –11 ± 2 164
L42a (EtCN) (9.5 ± 0.4) × 104b 4.1 ± 0.1 −12.4 ± 0.7 (7.0 ± 0.3) × 10−2b 14.8 ± 0.1 18.2 ± 0.7 144
L44 (MeTHF) (2.1 ± 1.0) × 106c 2 ± 1 −17 ± 6 (5.2 ± 2.0) × 102c 11 ±2 10 ± 8 160
L41a (THF) (1.5 ± 0.02) × 108c 1.82 −10.8 240 ± 6c 13.9 25.1 163
L41d (MeTHF) (6.6 ± 3.5) × 105c 2.2 ± 0.2 −23 ± 2 160
L43c (THF) (6.9 ± 0.02) × 107c 7.67 19.1 470 ± 0.02c 15.9 37.5 161
L40a (THF) (1.8 ± 0.03) × 108c 5.59 8.39 1600 ± 0.05c 15.4 35.9 161
L36 (THF) (7.6 ± 0.2) × 10−1b 5.83 ± 0.31 −26.3 ± 1.7 (1.1 ± 0.1) × 10−3b 8.10 ± 0.26 −3 ± 1 162
a

At 223 K.

b

At 183 K.

c

At 193 K.