. Author manuscript; available in PMC: 2018 May 22.

Published in final edited form as: Chem Rev. 2017 Jan 19;117(3):2059–2107. doi: 10.1021/acs.chemrev.6b00636

Table 4.

Selected Thermodynamic Parameters for the Formation of 1:1 Cu:O₂ Adducts

ligand (solvent)	K_eq (M⁻¹)	ΔH° (kcal mol⁻¹)	ΔS° (cal mol⁻¹ K⁻¹)	ref
L42a (EtCN)	(1.35 ± 0.04) × 10⁶^a	−10.73 ± 0.05	−30.6 ± 0.2	144
L44 (MeTHF)	(6.3 ± 1.9) × 10³^b	−9.6 ± 0.5	−32.0 ± 2.6	160
L41a (THF)	(6.5 ± 0.02) × 10⁵^b	−11.6	−33.5	163
L43c (THF)	(1.5 ± 0.06) × 10⁵^b	−8.22	−18.5	161
L40a (THF)	(1.1 ± 0.03) × 10⁵^b	−9.82	−27.2	161
L36 (THF)	(7.0 ± 0.1) × 10²^a	−2.27 ± 0.07	0.614 ± 0.382	162

At 183 K.

At 193 K.