Fig. 7.

Monitoring Li in the Cu current collector during plating and stripping. a Operando NDP during four plating and stripping cycles, focusing on the 10 μm thick Cu current collector region from 0 to 10 μm of the measurement shown in Fig. 1b. The depth is measured starting from the interface of the of the Cu current collector with the ambient atmosphere (as indicated by Fig. 1a,b), hence the Li-metal is plated on right side in the Figure. b Total amount of Li per cm² in the Cu current collector during the four plating/stripping cycles. c Cu lattice parameter from operando XRD during 15 cycles at 1.0 mA cm^–2. The variation is the consequence of the daily temperature changes in the lab, indicating a 4 °C temperature difference during day and night. d Total amount of Li per cm² during the first plating/stripping cycle at different current rates, quantifying the amount of Li incorporation in Cu depending on the applied potential