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. 2018 Jun 22;8:9492. doi: 10.1038/s41598-018-27798-z

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© The Author(s) 2018

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Measurement techniques used in the study. (a) Optical microscopy. The white and blue arrows indicate the strain directions relative to the long lengths of the wires used in the study. The characteristic crack spacing is indicated by λ. (b) Scanning electron microscopy (SEM)—the crack width f is visible. The inset shows a depth profile of a crack. (c) Atomic force microscopy (AFM) was used to measure the evaporated film thickness and uniformity. (d) Optical interference microscopy was used to produce non-contact, large surface tomography of cracking and buckling. (e) Piezoresistance characterization via current-voltage (IV) measurements using a probe station. The inset shows how the IV changes with applied strain.