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. 2018 Jun 22;8:9492. doi: 10.1038/s41598-018-27798-z

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© The Author(s) 2018

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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The effect of film thickness on process-induced cracking of thin metal films evaporated onto PDMS. (a) A chromium/gold (1.4/21.6 nm) evaporated line results in PIC perpendicular to the line edge—indicated by the white ellipses. (b) A PIC associated with a large edge defect. (c) Zoom on a chromium/gold (2.6/21.6 nm) line showing the difference between PIC and external strain-induced cracking (SIC). (d) A chromium/gold (4.1/21.6 nm) evaporated line results in a curved or ‘wavy’ PIC⁵⁰. (e) and (f) Zooms on the chromium/gold (4.1/21.6 nm) metallization showing the difference between PIC and external strain-induced cracking (SIC) after external straining in a relaxed state. The lines are 150 µm wide.