Table 1.
Thin film | Support/substrate | Direction | GF | strain range | Mechanism | Ref. |
---|---|---|---|---|---|---|
Au (>100 nm) | Steel and Al-alloy | L | 1–4 | <1% | Geometric | Parker and Krinsky86 |
Au (<100 nm) | Steel and Al-alloy | L | 10–100 | <1% | Non-uniform film | Parker and Krinsky86 |
Au (10–100 nm) | Fused silica | L | 2 | Not given | Geometric | Reale87 |
Au (3–15 nm) | Glass | L | 20–60 | Not given | Non-uniform film | Hok et al.88 |
Au (50 nm) | Silicon | L | 460 | not given | Inhomogenized film | Mohanasundaram et al.89 |
Cu (188 nm) | Mylar | L/T | 2.2/−0.6 | <0.1% | Geometric | Rajanna and Mohan90 |
Au (200 nm) | PDMS/Kapton | L | 40–75 | 0–0.6% | None suggested | Wen et al.91 |
Au (nanowires) | paper/PDMS | L | 7.4 | 0–12.5% | Cross conduction | Gong et al.92 |
Au (200 nm) | PDMS | L | 1000 | 0–0.12% | Micro-cracking | Liu et al.93 |
Pt (20 nm) | PUA | L | 2000 | 0–2% | Nano-scale cracking | Kang et al.94 |
Au/Cr (20/1 nm) | PDMS | T | 5–40 | 0–40% | Large scale cracking | this work |
*L = longitudinal, T = transversal.