Fig. 4. (A) Three deposition cycles of PLL and Cu-3G (0.5 mM) in PB (0.1 M) at pH = 10.12 and concomitant 3 × 10 min runs of CPE at 1.1 V vs. Ag/AgCl with intermittent breaks of 10 min and concomitant attempt to supply the electrolyzed surface with Cu-3G at an ITO-coated chip placed in an EC-OWLS cell; (B) the same sequence applied to PAH and Cu-2GH layers.
