Table 3.
Acetone and isopropyl alcohol concentrations in fabrication and package plants.
| Facility | Process | Isopropyl Alcohol | Acetone | ||||
|---|---|---|---|---|---|---|---|
| Number of Samples | Number of No Detection Samples | Range (ppm) | Number of Samples | Number of No Detection Samples | Range (ppm) | ||
| Fabrication | PHOTO | 17 | 15 | 0.08–28.99 | 17 | 17 | |
| DIFF | 7 | 4 | 0.26–0.81 | 7 | 4 | 0.02–0.15 | |
| CMP | 4 | 3 | 0.26 | 4 | 4 | ||
| T/F | 4 | 4 | 4 | 3 | 0.06 | ||
| IMP | 3 | 1 | 0.25–0.26 | 3 | 2 | 0.01 | |
| ETCH | 4 | 4 | 4 | 4 | |||
| Package | A/P | 3 | 3 | 3 | 0 | 6.23–9.07 | |
| A/P cleaning room | 1 | 1 | 1 | 0 | 9.66 | ||
| D/A | 4 | 4 | 4 | 0 | 0.96–4.32 | ||
| Chip mounting | 3 | 0 | 1.24–2.37 | 3 | 3 | ||
| TDBI | 7 | 7 | 7 | 7 | |||
| SPP | 1 | 0 | 8.28 | 1 | 1 | ||
PHOTO: photolithography, DIFF: diffusion, CMP: chemical mechanical polishing, T/F: thin film, IMP: ion implantation, ETCH: etching, A/P: adhesive print, TDBI: test during burn-in, SPP: solder ball paste print.