Table 4.
Agents | Chemicals | MDL | SBA | SPP | TDBI | TEST | Test & MVP | Control † |
---|---|---|---|---|---|---|---|---|
VOCs (ppb) |
Number of samples | 5 | 0 | 0 | 3 | 1 | 3 | 1 |
Benzene | 0.14–0.34 | 0.06–0.18 | 0.22 | ND-0.15 | ND | |||
Toluene | 2.02–3.53 | 1.98–3.38 | 3.26 | 2.6–163.7 | 3.78 | |||
Ethylbenzene | 0.29–0.48 | 0.26–0.33 | 0.08 | 0.33–0.76 | 1.04 | |||
p-Xylene | 0.38–0.60 | 0.34–0.48 | 0.09 | 0.46–0.51 | 0.59 | |||
m-Xylene | 0.01–0.10 | ND-0.12 | ND | 0.04–0.44 | 0.12 | |||
o-Xylene | 0.15–0.28 | 0.12–0.23 | 0.02 | 0.17–0.64 | 0.19 | |||
Isopropyl alcohol | 0.94–1720 | 5.80–11.9 | ND | 11.7–23.5 | ND | |||
Methyl ethyl ketone | 0.54–1.53 | 0.63–0.96 | 0.48 | 0.89–1.26 | ND | |||
Tetrachloroethylene | ND–21.5 | 0.19–0.40 | ND | 0.35–0.91 | ND | |||
1-propoxy-2-propanol | ND-58.8 | ND | ND | ND | ND | |||
Styrene | ND-0.45 | ND-0.25 | 0.18 | 0.36–0.55 | ND | |||
Benzaldehyde | 0.75–1.02 | 0.48–0.55 | 0.6 | 0.70–1.10 | 1.02 | |||
2-Ethyl-1-hexanol | 0.99–4.83 | 0.63–1.32 | 0.29 | 0.65–1.40 | ND | |||
Metals (μg/m3) | Number of samples | 0 | 3 | 3 | 3 | 0 | 0 | 4 |
As | 0.08–0.16 | ND | ND | ND-0.12 | ||||
Ag | 0.01–0.32 | 0.01-0.26 | ND-0.05 | ND-0.04 | ||||
Al | 4.98–7.25 | ND | ND-0.06 | ND-26.2 | ||||
Cu | 0.93–2.07 | ND-0.38 | ND-0.64 | ND-2.04 | ||||
Pb | 0.066-0.068 | ND-0.06 | ND-0.01 | 0.01-0.10 | ||||
Sb | ND | ND | ND | ND | ||||
Sn | 0.26–0.61 | 0.03-0.84 | ND-1.17 | 0.03-0.22 |
MDL: module chip mount, SBA: solder ball attach, SPP: solder ball paste print, TDBI: test during burn-in, TEST: electrical test, MVP: marking, visual inspection and packing; ND: not detected, † Control: outdoor air inside plant.