Table 5.
Total volatile organic compound concentrations by process in semiconductor fabrication and package facilities.
| Facility | Process | Task | Total Volatile Organic Compounds | |||||
|---|---|---|---|---|---|---|---|---|
| N | AM, ppb | SD, ppb | GM, ppb | GSD | Max, ppm | |||
| Fabrication | CMP | Maintenance | 302 | 336.2 | 3544.0 | 36.1 | 4.1 | 54.9 |
| DIFF ** | Operation | 388 | 24.1 | 8.6 | 22.5 | 1.5 | 0.038 | |
| Maintenance | 3287 | 939.4 | 2527.4 | 410.5 | 2.7 | 34.5 | ||
| ETCH | Operation | 742 | 194.9 | 48.1 | 189.3 | 1.3 | 0.319 | |
| Maintenance | 2838 | 326.9 | 1182.9 | 184.8 | 2.5 | 30.7 | ||
| IMP | Operation | 228 | 200.5 | 20.3 | 199.5 | 1.1 | 0.292 | |
| Maintenance | 8342 | 229.9 | 337.6 | 199.6 | 1.8 | 16.4 | ||
| PHOTO ** | Operation | 1319 | 274.4 | 126.2 | 255.2 | 1.4 | 0.743 | |
| Maintenance | 1907 | 2365.5 | 18,359.0 | 497.6 | 4.8 | 671.1 | ||
| T/F ** | Operation | 156 | 196.9 | 29.6 | 195.0 | 1.1 | 0.309 | |
| Maintenance | 372 | 931.7 | 924.6 | 797.6 | 1.6 | 12.7 | ||
| Overall ** | Operation | 2833 | 209.1 | 121.9 | 163.4 | 2.4 | 0.743 | |
| Maintenance | 17,048 | 638.9 | 6316.5 | 250.8 | 2.8 | 671.1 | ||
| Package and test | A/P | Operation | 36 | 6281 | 2490 | 43.1 | 1.2 | 14.0 |
| Maintenance | 1440 | 15,730 | 76,879 | 45.7 | 1.6 | 2230.5 | ||
| MDL | Maintenance | 3662 | 4588 | 5249 | 31 | 1.5 | 59.8 | |
| Test handler | Maintenance | 93 | 11,633 | 34,887 | 45.2 | 1.4 | 339.1 | |
| Overall ** | Operation | 36 | 6280.6 | 2490.2 | 43.1 | 1.2 | 14.0 | |
| Maintenance | 5195 | 7802.1 | 41,272.6 | 34.7 | 1.6 | 2230.5 | ||
CMP: chemical mechanical polishing, DIFF: diffusion, ETCH: etching, IMP: ion implantation, PHOTO: photolithography, T/F: thin film, A/P: adhesive print, MDL: module, AM: arithmetic mean, SD: standard deviation, GM: geometric mean, GSD: geometric standard deviation, Max: maximum, **: p < 0.01 (comparison of concentration between operation and maintenance by t-test).