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. 2018 Jul 13;8:10671. doi: 10.1038/s41598-018-28812-0

Figure 10.

Figure 10

Cross-sectional FIB ion image of the electroplated Cu films with different preferred orientations after the oxidation at 200 °C for 120 min. (a) Highly (111)-oriented nt-Cu film. (b) Randomly-oriented Cu film. (c) Highly (200)-oriented Cu film.