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. 2018 Jul 15;18(7):2289. doi: 10.3390/s18072289

Figure 8.

Figure 8

(a) Image of a typical wafer with the indications of the failed and of the high-leakage devices. The majority of the failed devices are on the edge of the wafer where the majority of defects are present; (b) the leakage currents of the good devices do not show any dependence on the particular edge structure.