Table 2.
Exposure metrics used to classify wafer fabrication workers in epidemiologic cancer risk studies.
| Authors∗ | Facility | Manufacturing era | Fab/nonfab | Operation | Job | A group of agents or matrix | Specific agent including carcinogen |
|---|---|---|---|---|---|---|---|
| Sorahan et al (1985) [9]A | One wafer fab facility | 1970–1982 | N/A | N/A | N/A | N/A | N/A |
| Sorahan et al (1992) [8]A | One wafer fab facility | 1982–1989 (7 years of follow-up) | N/A | N/A | N/A | N/A | N/A |
| Nichols and Sorahan (2005) [7]A | One wafer fab facility | 1970–2002 (13 years of follow-up) | N/A | N/A | N/A | N/A | N/A |
| McElvenny et al (2003) [6]C | One wafer fab facility | Fab/nonfab area | N/A | N/A | N/A | N/A | N/A |
| Beall et al (2005) [1]B | Wafer fab manufacture, masking and packaging (East Fishkill and Burlington‡) | 1983/1984–1999 1965–1973/1974–1988/1989–1999 |
Classified by facility | N/A | N/A | N/A | N/A |
| Hard disk drives, network servers, and micro drives (San Jose) | 1965–1972/1973–1989/1990–1999 | Fab† versus nonfab | N/A | N/A | N/A | N/A | |
| Bender et al (2007) [2]B | Wafer fab, masking and packaging (East Fishkill and Burlington) | Early/middle/late (no specific date) | Fab | N/A | Operators & Equipment service technician/Engineers, supervisors & managers | N/A | N/A |
| Boice Jr et al (2010) [3] | Hard disk drives, network servers, and micro drives (San Jose‡) (34 wafer fab facilities) | Early/middle/late (no specific date) | Nonfab | Office/nonoffice | Professional or office workers; back-end workers and other workers | N/A | N/A |
| Darnton et al (2010) [4]C | One wafer fab facility | N/A | Fab | N/A | N/A | Solvent, acid, toxic gases | Antimony trioxide, arsenic & its compounds, carbon tetrachloride, chromic acid, sulfuric acid, etc |
| Lee et al (2011) [5] | 9 wafer fab facilities and 2 fab packaging facilities | N/A | Classified by job | N/A | Classified by facility (operator, service engineer, process engineer, supervisor, utility | N/A | N/A |
fab, fabrication.
“N/A” indicates that exposure surrogates were not analyzed in the classification of study participants.
∗
Same character (A, B, C) indicates the same study cohort group.
†
No classification of type of fab (wafer fab and chip packaging).
‡
East Fishkill & Burlington: masking, clean rooms, test/probe/dicing/slicing/die removal/wire bonding, process equipment maintenance, research and development, other manufacturing; San Jose: head fabrication, test/dice/slice, assembly, facilities/laboratories, research & development, other manufacturing.