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. 2018 Sep 10;8:13524. doi: 10.1038/s41598-018-31912-6

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© The Author(s) 2018

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Schematic illustration of the microfabrication process (from (a–e)) and the transfer (from (f–i)) of the porous PDMS membranes to OOCs. (a,b) Deposition of the sacrificial and water-soluble poly (acrylic acid) (PAA) layer by spin coating. (c) Deposition of the PDMS by spin coating to define the membrane thickness. The layer is then thermally baked. (d) Deposition and patterning of the Al masking layer to define the desired pore features (PS and P-P). (e) Dry etching of the Al and the PDMS layers. The Al masking layer is then removed by wet etching, leaving exposed the patterned PDMS surface. (f) First step required for transferring the membrane: oxygen plasma treatment on the PDMS membrane and on the bottom surface of the PDMS-based OOCs. (g) The porous membranes, carried by the silicon substrate, are placed in contact with the activated surfaces of the OOCs and then kept under a constant pressure to promote mechanical bonding. (h) Releasing of the porous membranes by dissolving the sacrificial layer (PR or PPA)in water in an ultrasonic bath. (i) Final assembling of the OOC by attaching the top part to complete the microchannel top side.