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. 2018 Sep 11;8:13581. doi: 10.1038/s41598-018-32045-6

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© The Author(s) 2018

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Analysis of copper nanowire fabrication conditions and morphology. (A–C) Scanning electron microscopy (SEM) images of copper nanowires deposited for 2, 6, and 10 min, respectively. (D) Fabricated copper nanowire and its component analysis maps determined by energy dispersive X-ray spectroscopy (EDS). (E) Atomic force microscopy (AFM) analysis map showing nanowire thickness and morphology. (F) Graph showing correlation between electroless deposition time and nanowire width (n = 5, mean ± standard error). (G) Graph showing correlation between electroless deposition time and nanowire thickness (n = 5, mean ± standard error).