Skip to main content
. 2018 Sep 26;2018:6161230. doi: 10.1155/2018/6161230

Table 3.

Tm and ΔH comparison of untreated ACV and PCL v. treated ACV-PCL by DSC.

Material Tm (°C) ΔH (J/g)
untr. PCL 70.20 ± 0.10 73.0775 ± 1.3384
VASE-tr. 0:100 (w:w) ACV:PCL 63.84 ± 0.43 75.3630 ± 4.7970
VASE-tr. PCL in 10:90 (w:w) ACV:PCL device 65.60 ± .030 69.9022 ± 1.5858
VASE-tr. PCL in 30:70 (w:w) ACV:PCL device 65.58 ± 1.56 53.2311 ± 8.3285
VASE-tr. PCL in 50:50 (w:w) ACV:PCL device 65.01 ± 0.70 19.6963 ± 7.8685

VASE-tr. ACV in 10:90 (w:w) ACV:PCL device 238.49 ± 7.72 14.9521 ± 7.6689
VASE-tr. ACV in 30:70 (w:w) ACV:PCL device 233.87 ± 0.91 26.7761 ± 19.9455
VASE-tr. ACV in 50:50 (w:w) ACV:PCL device 232.81 ± 0.30 53.5217 ± 9.5136
VASE-tr. 100:0 ACV:PCL 233.82 ± 0.20 55.5956 ± 3.7339
untr. ACV 257.29 ± 0.34 143.5112 ± 23.3110

untr.: materials left untreated.

VASE-tr.: materials treated by VASE method.

Tm: melting point.

ΔH: enthalpy of melting.