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. 2018 Mar 20;9(3):138. doi: 10.3390/mi9030138

Figure 1.

Figure 1

Through via hole fabrication process by deep reactive-ion etching (DRIE): (a) Sample cleaning; (b) Deposition of mask material; (c) Transfer of desired pattern; (d) Desired pattern achieved; (e) Inductively coupled plasma-reactive ion etching (ICP-RIE) dry etching; (f) Removal of mask residual.