Table 1.

Fused silica etch rate and selectivity.

Mask Material	Etch time (min)	Etched SiOx Depth (μm)	Etched Mask Depth (μm)	Etch Rate (μm/min)	Selectivity
KMPR 1035	110	57	43	0.52	1.33
a-Silicon	2.5	1	0.27	0.4	3.7
Chromium	45	22	1	0.49	22