Table 2.

Material properties utilised in this work as obtained from the Coventorware^® Materials Library for the PolyMUMPs^TM fabrication process. All properties in this table are given at room temperature (300 K) and all references to polysilicon refer to the Poly2 layer.

Property	Value	Unit
Density of polysilicon	2.23	g/(cm)${}^3$
Young’s modulus of polysilicon, E	158	GPa
Poisson’s ratio of polysilicon, $\nu$	0.22	-
Thermal expansion coefficient of polysilicon, $\alpha$	2.80	$\mathsf{\mu }$m/mK
Specific heat capacity of polysilicon, c	100	J/kgK
Thermal conductivity of polysilicon, $k_p$	32	W/mK
Thermal conductivity of air, $k_a$	0.0262	W/mK
Thermal conductivity of silicon nitride, $k_n$	25	W/mK
Electrical resistivity of polysilicon	30	$\mathsf{\mu }·$ $\mathsf{\Omega }·$ m