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. 2018 Aug 22;9(9):422. doi: 10.3390/mi9090422

Figure 4.

Figure 4

Images of Parylene damage due to high heat or radiation exposure. (a) Cracked Parylene after development and soft baking at 115 °C for 3 min; and (b) air bubbles appeared under the film, during hard bake at 90 °C for 15 min, in regions previously exposed to UV light during lithography.