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. 2017 Dec 1;8(12):354. doi: 10.3390/mi8120354

Figure 15.

Figure 15

Simplified process flow (a) silicon-on-insulator (SOI) with patterned waveguides and Al pads, (b) front and back patterned Cr mask, (c) front protective layer and backside etch, (d) backside polymer deposition and micro-opto-electro-mechanical systems (MOEMS) etch, (e) MOEMS release by stripping polymer [33].