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. 2016 Sep 8;7(9):163. doi: 10.3390/mi7090163

Figure 2.

Figure 2

Main steps of silicon-based MEAs micromachining: (a) backside dicing; (b) backside glassing and polishing; (c) backside metallization; (d) schematic of top-view of the array backside after dicing and glassing including nine collections of 5 × 5 arrays; (e) process flow of dicing variable height electrodes; (f) frontside dicing; and (g) frontside wet-etching.