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. 2016 Sep 8;7(9):163. doi: 10.3390/mi7090163

Figure 7.

Figure 7

SEM images of masking process: (a) electrode array covered with dry-film photoresist after RIE process. Dry-film photoresist follows the 3D structure of the electrodes; (b) uniform tip-exposure of variable-height electrodes after RIE and plasma asher etching process; and (c) electrode-tip after removing the mask.