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. 2016 Sep 8;7(9):163. doi: 10.3390/mi7090163

Table 2.

Comparison of conventional and proposed masking processes.

Conventional Method [32] This Work
First Masking Process:
  • -

    Photoresist coating

  • -

    Vacuum degassing 30 min

  • -

    Pre-baked

  • -

    UV exposure

  • -

    Developing

  • -

    Hard-bake 7 h

  • -

    Tip-Metallization

  • -

    Lift-off

 Single masking process:
  • -

    Parylene-C deposition

  • -

    Dry-film deposition

  • -

    Soft-bake

  • -

    Plasma etch

  • -

    Tip-Metallization

  • -

    Lift-off
Second Masking Process:
  • -

    Parylene-C deposition

  • -

    Photoresist coating

  • -

    Vacuum 30 min

  • -

    Hard-bake 10 h

  • -

    Plasma etch

  • -

    Lift-off