Table 1.

The detailed sputtering parameters for each layer.

Layer	Power (W)	Pressure (Pa)	Gas Flow (sccm)	Substrate Temperature (°C)
AlN	RF 150	0.6	Ar:8 N2:6	300
SiO2	RF 200	0.3	Ar:5	150
W	DC 100	0.3	Ar:5	150