| SUA | Single Unit Activity |
| MEMS | Microelectromechanical systems |
| Si | Silicon |
| PTE | Power Transfer Efficiency |
| PDL | Power Delivered to the Load |
| SNR | Signal to Noise Ratio |
| BMI | Brain Machine Interfaces |
| RF | Radio Frequency |
| CP | Conducting Polymer |
| FF-WINeR | Free-floating wireless implantable neural recording system |
| CMOS | Complimentary metal-oxide-semiconductor |
| PDMS | Polydimethylsiloxane |
| ASIC | Application Specific integrated circuit |
| MCU | Microcontroller unit |
| BLE | Bluetooth Low Energy |
| PA | Power amplifier |
| AFE | Analog Front-End |
| Tx | Transmitter |
| Rx | Receiver |
| SAR | specific absorption rate |
| HFSS | High frequency structural simulator |
| PCE | Power Conversion Efficiency |
| TSV | Through-silicon-vias |
| DRIE | Deep reactive ion etcher |
| IC | Integrated Circuits |
| DUT | Device under test |
| AF | Acceleration factor |
| RH | Relative humidity |
| MTTF | Mean time to failure |