Table 5.
Polymer | Fabrication process | Features | Applications |
---|---|---|---|
Parylene |
Chemical vapor deposition (CVD) Etching by oxygen plasma Hot embossing Lithography |
Young’s modulus, E ~ 5 GPa Chemically inert Low intrinsic stress and gas permeability Hydrophobic Optically transparent Vulnerable to temperature |
Electrostatic actuator [155] Micro-valve [165] Spring [166] Electrostatic micro-peristaltic pump [167] |
Polypropylene |
Injection molding Laser ablation |
Young’s modulus, E ~ 1.45 GPa Vulnerable to oxidants Thermal resistance Large thermal coefficient of expansion Opaque |
Surface stress cantilever sensor [156] Component in air-coupled piezoelectric transducer [168] Piezo-electret film transducer [169] |
Fluoropolymer Teflon® Polytetrafluoroethylene Tefzel® Fluoroethylenepropylene |
Spin coating Ion beam sputter etching Magnetically controlled reactive ion etching |
Young’s modulus, E ~ 1.45 GPa (Teflon®) Chemically inert Hydrophobic Thermally stable Teflon® smoothest surface morphology |
AFM-based biochemical sensor [157] Micro-tube [170] Micro-fluidic channel [171] |
SU-8 |
Spin coating Photolithography Excimer laser patterning Pyrolysis Dry etching |
Young’s modulus, E ~ 5 GPa Low molecular weight Chemically inert High refractive index Compatibility with grayscale lithography |
Optical waveguide [172] Micro-needles [173] Micro-resonator [174] AFM cantilever [175] Surface stress cantilever sensor [68] |
Polyethylene terephthalate | Excimer laser patterning and laser ablation |
Young’s modulus, E ~ 2.8 GPa Excellent resistance to moisture High impact resistance |
Cantilever biosensor [159] Mechanical substrate [176] Micro-pump [177] |
Polyimide |
Spin coating Dry etching using oxygen or fluorine plasma Hot embossing Lithography |
Young’s modulus, E ~ 7.5 GPa Chemically inert Stable at high temperature and heat Vulnerable to alkalis Low susceptibility to moisture |
Scanning probe [160] Humidity sensor [180] Micro-channels [181] |
TOPAS® |
Spin coating Nano-imprint lithography |
Young’s modulus, E ~ 3.5 GPa High chemical inertness Low susceptibility to moisture Good optical transmission |
Water vapor sensor [161] Optical waveguide [182] Micro-fluidic devices [183] |
Polystyrene |
Injection molding Solvent casting technique |
Young’s modulus, E ~ 3.0 GPa Vulnerable to moisture Optically transparent |
Surface stress sensor [162] Accelerometer [184] |
PDMS |
Spin coating Cast molding |
Young’s modulus, E ~ 0.75 MPa Incompatible with organic solvents Optically transparent Gas permeable |
Micro-valve [185] Magnetic actuator [186] Micro-pump [187] Micro-channel [188] |
PMMA |
Injection molding Hot embossing Wire printing Laser ablation |
Young’s modulus, E ~ 3.1 GPa Low susceptibility to moisture Optically transparent |
Micro-channel [189] Acceleration sensor [190] Nano-structure arrays [191] |