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. 2018 Oct 25;8:15818. doi: 10.1038/s41598-018-34198-w

Figure 1.

Figure 1

Top: dip coating of SS316L using SiO2-TiO2 suspension. Bottom: patterning process using microstamping. Pattern fabrication on gold (A), PDMS pre-polymer poured onto pattern (B), PDMS stamp after polymerization (C), microstamping using SiO2-TiO2 suspension (D) and transferred SiO2-TiO2 pattern on SS316L.