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. 2018 Nov 20;18(11):4042. doi: 10.3390/s18114042

Table 6.

FET device characteristics for EGFET sensors.

Refs. FET Device Model CMOS Process (µm) Main Features W/L (µm/µm)
[158] NC N/A nr SOI-FET working in parasitic Bipolar Junction Transistor (BJT) operation method nr
[159] NC N/A 0.5 CMOS–DPDM n–well 600/20
[30,32,42,92,94,101,104,105,113,114,117,139,147,148,160,161,162,163,164,165,166,167] C CD4007UB nr CMOS dual complementary pair plus inverter nr
[41,168,169] C NDP6060L nr n–Channel logic level enhancement mode FET nr
[170,171] C HEF4007 nr Dual complementary pair and inverter nr
[172] C BS170 nr n−Channel MOSFET 9700/2
[173] NC N/A 0.16 Differential source follower 8/2
[174] NC N/A 0.35 Rectangular p-type MOSFET 18/1
[175] NC N/A 0.6 Pt and Au gate MOSFET 100/10
[95,108,109,138] C LT1167 nr Instrumentation amplifier nr
[176] C 2SK246Y nr n-Channel junction FET nr

C, commercial FET device; NC, noncommercial FET device; DPDM, double poly double metal; nr, not reported; N/A, not applicable.