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. Author manuscript; available in PMC: 2019 Jul 1.
Published in final edited form as: IEEE J Solid-State Circuits. 2018 Apr 27;53(7):2054–2064. doi: 10.1109/JSSC.2018.2820705

Fig. 10.

Fig. 10

(a) SEM images of each sensor after gold plating colored to show texture. (b) Minimum resistance measured between the working electrodes with different gold plating times. Inset shows metal particles that can provide a low resistance path if plated for an extended period.