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. 2018 Dec 13;18(12):4414. doi: 10.3390/s18124414

Table 1.

Common design specifications of four transducers used in FEA simulation.

Center frequency [MHz] 60
Thickness of the piezoelectric layer [mm] 0.033
Thickness of the matching layer [mm] 0.007
Thickness of the backing layer [mm] 0.308
Piezoelectric material PMN-32%PT
Matching layer material Silver loaded epoxy
Backing layer material E-Solder 3022
Adhesive material E-Solder 3022
Signal line material Copper