TABLE I.
Integrated Neural Interface [9] | Microwave Back-scattering [54] | WINeR probes [11] | Neural Dust [14] | MOTE | |
---|---|---|---|---|---|
Power Source | RF Coil | RF | RFCoil | Ultrasonic | Optical |
Gain(dB) | 60 | - | 40 | - | 30 |
BW(KHz) | 5 | 5 | 8 | > 30 | > 10 |
Noise Floor | 5.1 μ VRMS | 63 μ VRMS | 5.4 μ VRMS | 180 μ VRMS | ~ 15 μVRMS |
DC Power | 135 μ W† | NA | 19.3 μW† | NA | < 1 μW |
Volume(mm3) | > 10 | 360 | > 4‡ | 2.4 | 4.7 × 10−3* |
Weight‡(μg) | > 2.3 × 104 | > 8.38 × 105 | > 9300 | > 7600 | 11 |
Min. Cross-section | > 0.3 mm | > 10 mm | > 0.3 mm | > 0.5 mm | 50 μm |
Per channel
Estimated
Die thickness of 330 μm multiplied by circuit dimensions, can further be reduced by die thinning.