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. Author manuscript; available in PMC: 2019 Dec 1.
Published in final edited form as: J Neural Eng. 2018 Sep 24;15(6):066024. doi: 10.1088/1741-2552/aae39d

Figure 1.

Figure 1.

Stack-ups of μECoG array designs fabricated from (a) liquid crystal polymer (LCP), and (b) polyimide (PI). Both arrays were fabricated using gold for contacts and interconnects. The LCP array (a) was fabricated using Ultralam 3850/3908 as the PCB core and coverlay, respectively. The PI array (b) was fabricated using Kapton 50HN as the PCB core, and solution-processed PI-2611 as the coverlay. Electrode geometry and inter-electrode spacing were roughly matched, shown in the microscopy images. Micro-vias are shown in the center of each contact to connect to the embedded traces.