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. 2019 Jan 29;9:899. doi: 10.1038/s41598-018-38422-5

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© The Author(s) 2019

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Sintering behavior of the copper NPs. (a) Change in the copper (111) XRD peak of Cu1 (i) before heating; after heating at (ii) 100 °C, (iii) 200 °C, (iv) 300 °C, (v) 400 °C, and (iv) 500 °C. (b) The behavior of Cu3. The shift to lower angles with heating, which was observed for (a,b), is due to the thermal expansion of the crystal lattice of copper. (c) Relationship between S_T/S_i and the sintering temperature (_T) of Cu1 and Cu3. S_T/S_i: crystallite size ratio at _T (S_T: C_s at _T).