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. 2019 Jan 29;9:899. doi: 10.1038/s41598-018-38422-5

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© The Author(s) 2019

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Fabrication of copper electric circuits on flexible films by screen printing the copper nanopastes. (a) Copper electrodes on a PI film with bending. (b) Copper electrodes on a PEN film. (c) An optical microscopic image of the copper electric circuits prepared by screen printing on a PI film using a fine pattern screen mask (L/S: 40/40 (μm/μm)). (d) A 3D image of the copper electric circuits shown in (c). (e) A depth profile of the copper electric circuits. The height of the circuits was approximately 8 μm. The printed copper nanopastes on the films were pressureless sintered at 200 °C under a N₂ atmosphere for 30 min.