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. 2019 Jan 29;9:899. doi: 10.1038/s41598-018-38422-5

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© The Author(s) 2019

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Adhesion of the copper substrates with use of the copper nanopaste and the share strength of the die attach material. (a) Schematic and photo images for the preparation of a model IC chip-mounted die with use of the copper nanopaste and the die share stress measurement. (b) An HAADF-STEM image of the adhesion between copper NPs on the copper substrate. (c) A magnified image of the binding position between a copper NP and the copper substrate. The white-colored solid square shown in (b) is the magnified position. (d) An HAADF-STEM image to observe the crystallinity of the sintered position. The white-colored solid square exhibited in (c) is the magnified position. (e) A Fourier transfer image of (d). The bright spots could be assigned as (111) diffraction of Cu.