DED Powder Feed |
[70] |
Ti6Al4V |
Ellipsoidal |
Hybrid |
3D-Uncoupled, Pan Computing |
Incorporating forced convection boundary conditions in the model improves temperature and corresponding residual stress estimates. |
[64] |
Ti6Al4V |
Ellipsoidal |
Quiet |
3D-Coupled, Not Listed |
When printing on cantilevered plate for model verification, plate will tend to bend upwards. |
[57] |
Inconel 718 + Ti6Al4V |
Gaussian |
Not Specified |
3D-Uncoupled, ABAQUS |
For printing tall structures, reducing the layer thickness can increase distortion, while simultaneously decreasing residual stresses. |
DED Wire Feed |
[76,77] |
Mild Steel Wire |
Gaussian |
Inactive |
3D-Coupled, ABAQUS |
Residual stress across a line of deposit is uniform with low affect from previous layers’ stress profile. |
[123] |
Steel Wire |
Ellipsoidal |
Quiet |
3D-Coupled, MSC-Marc |
Final deposition path can have significant effect on the final residual stresses |
[68] |
Inconel 718 Wire |
Uniform Source |
Inactive |
3D-Coupled |
Using a large-strain plasticity model can result in higher accuracy, but also increases computational cost significantly. |
PDF EBM |
[81] |
Ti6Al4V |
Gaussian |
None-Single Scan |
3D-Coupled, ABAQUS |
Increase in bed preheat temperature as high as 50°C can reduce residual stresses by ~20%. |
[124] |
Rene 80 (Ni-based superalloy) |
Gaussian |
None-Single Scan |
3D-Coupled, SYSWELD |
Yield stresses were easily achieved after heat source passing. |
[84] |
Inconel 718 |
Effective (Temp-Driven) |
Inactive |
3D-Uncoupled, ABAQUS |
Preheating substrate prior to printing will reduce the magnitude of the residual stresses developed. |
PBF SLM |
[65] |
AlSi10Mg |
Gaussian |
Hybrid |
3D-Uncoupled, ABAQUS |
Relatively long laser exposure time (slower scan speeds) will tend to induce a much larger residual stress field. |
[73] |
Stainless Steel 316 |
Gaussian |
Inactive |
3D-Indirectly Coupled-FE ANSYS |
Residual stress calculation is reduced at high temperature when temperature-dependent thermophysical properties are accounted for. |
[82] |
Ti6Al4V |
Gaussian |
Inactive |
3D-Coupled, MSC-Marc |
No significant variation in residual stresses among different “square pattern” scan strategies, but significant variation in directional stresses. |
[125] |
Inconel 718 |
Double Ellipsoidal |
Quiet |
Thermal FE-Only Pan Computing |
Assuming powder layer is insulator can significantly overpredict temperatures in component. |
[62] |
Inconel 718 |
Ellipsoidal |
Hybrid |
3D-Weakly Coupled Pan Computing |
Rotating scan patterns can homogenize residual stress fields. |
[126] |
Fe-based |
Gaussian |
Inactive |
3D-Coupled ABAQUS |
Equivalent heat source method used from single-layer simulated temperature field, reduced computational cost and maintained accuracy. |
[71] |
Inconel 718 |
Gaussian |
Quiet |
3-D Coupled, ABAQUS |
Rotating 45° scan patterns produce the lowest planar stresses and deformation when compared with other scanning strategies |