Table 1.
Summary of PV technologies.
GEN | Technology | Production Method | Characteristics | Efficiency (%) | Reference |
---|---|---|---|---|---|
1GEN | m-Si | Czochralski | Expensive, stable | 24.4 | [8,15] |
1GEN | p-Si | Siemens | Low cost, high defect content | 19.9 | [15,16] |
1GEN | GaAs | Expitaxial growth | Expensive, good design control | 18.4–28.8 | [15,19,20] |
2GEN | a-Si | Large-area deposition | Non-toxic, short life cycle | 10.2–12.7 | [15,24] |
2GEN | μc-Si | Roll-to-roll | Low defect content, good degradability | 11.9–14.0 | [13,22] |
2GEN | CIGS | Deposition, co-evaporation | Tuneable band gap | 22.3 | [13,26,27] |
2GEN | CdTe | Deposition | High temperature tolerance, low fooling | 21 | [13] |
3GEN | DSSC | Roll-to-roll, | Work in low-light conditions, robustness | 5.0–20.0 | [30] |
3GEN | QDs | Solution casting | Efficient conductivity | 11.0–17.0 | [52] |
3GEN | OPSCs | Solution casting | High work function, thermally stable | 9.7–11.2 | [13,77] |
3GEN | PVSC (CH3NH3PbI3) | Sputtering/ printing | Cheap, simple | 21.1–21.6 | [13,87] |
3GEN | MJ 1 | Stacking | Wide range of design, Challenging manufacture | 35.8 | [13,105,111] |
3GEN | IMM 2 | Monolithic growth | Cheap, high band gap | 40–44.4 | [13,105,114,185] |
4GEN | BHJ 3 PSC 4 with GO/PEDOT:PSS | Solution casting | Reproducible and stable | 4.28 | [123] |
4GEN | PSC with G/PEDOT:PSS | Solution casting | Good functionality | 2.82–11.8 | [121,153] |
4GEN | PVSC 5 with Li-GO | Spray deposition | Stable, long lifetime | 1.07–11.14 | [186] |
4GEN | PVSC with rGO/PEDOT:PSS | Solution casting | Long lifetime, reduced elec.-hole recombination | 5.7–11.95 | [129,152,157,158] |
4GEN | PSCs with B-doped CNTs | Solution casting | Improved electron transport | 4.1–8.6 | [182] |
1 MJ: multi-junction; 2 IMM: inverted methamorphic multijunction; 3 BHJ: Bulk heterojunction; 4 PSC: polymer solar cell; 5 PVSC: perovskite.