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. 2017 Sep 5;9(9):413. doi: 10.3390/polym9090413

Figure 2.

Figure 2

(a) The thermal conductive mechanism in ceramic-ceramic (upper) and ceramic-polymer (lower). (b) Scheme of a randomly dispersed ceramic-polymer composite with below (upper) and above (lower) the percolation threshold volume fraction of filler. (c) Comparison of thermal conductivities with randomly dispersed various composites and their volume ratio effects [3,22,35,45,50]. (d) Comparison between several simulated fittings of thermal conductivity based on theories and experimental values for randomly dispersed Al2O3 filler-polymer composite [51]. Reprinted with permission from [51] Copyright (2000) IEEE.