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. Author manuscript; available in PMC: 2019 Oct 1.
Published in final edited form as: IEEE Sens J. 2018 Aug 6;18(19):7899–7906. doi: 10.1109/JSEN.2018.2863644

Fig. 4.

Fig. 4.

Die photographs of fabricated CMOS electrochemical instrumentation chip; (a) chip as received from foundry with functional blocks labeled, (b) chip after post-CMOS fabrication of (top) on-CMOS electrodes and (bottom) on-CMOS RTIL sensor/electrolyte layer.