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. 2017 Apr 24;3:16092. doi: 10.1038/micronano.2016.92

Figure 4.

Figure 4

Fabrication process flow for the anisotropically wet-etched pitch/roll silicon gyroscope. (a) First wet etching with self-aligned masks. (b) Second wet etching after local oxidation. (c) TEOS deposition and patterning, and thermal oxidation. (d) Thermal oxide patterning, polysilicon deposition and patterning. (e) Release. TEOS, tetraethyl orthosilicate.