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. 2017 Apr 10;3:17002. doi: 10.1038/micronano.2017.2

Figure 2.

Figure 2

(af) Process flow for the TSV fabrication9. (gi) Conventional fabrication approach with solder balls placed next to the via holes, resulting in low I/O densities, as in Ref. 10. (jl) Approach demonstrated in this work with TSVs filled with inkjet-printed dielectric polymer and solder balls placed in the same area as the TSVs to increase the I/O density. I/O, input/output; TSV, through silicon via.