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. 2017 Apr 10;3:17002. doi: 10.1038/micronano.2017.2

Figure 6.

Figure 6

SEM image of (a) the top view of the interposer with empty vias and the adjacent pads. (b) Via filled with the dielectric and Au UBM dispensed on top by SIJ. Scales are 100 and 50 μm, respectively. SEM, scanning electron microscope; SIJ, super inkjet; UBM, under bump metallization.