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. 2017 Apr 10;3:17002. doi: 10.1038/micronano.2017.2

Figure 9.

Figure 9

(a) SEM images of solder paste deposited on the vias filled with dielectric polymer and covered by printed UBM. Scale bars are 50 μm. (b) Schematic of the UBM and solder ball layout on the interposer for demonstrating the increase in I/O density. I/O, input/output; SEM, scanning electron microscope; UBM, under bump metallization.