Table 2.
Elemental composition of PCBs from mobile phones
| Base metals (%) | Precious metals (ppm) | Reference | |||||||
|---|---|---|---|---|---|---|---|---|---|
| Cu | Fe | Al | Pb | Sn | Zn | Ni | Au | Ag | |
| 32.3 | 0.5 | 1.8 | 0.3 | – | 0.1 | 0.7 | 30 | 4120 | Williams 2010 |
| 35.1 | – | – | 2.7 | 4.0 | – | – | 1200 | – | Kim et al. 2011 |
| 39.6 | 1.4 | 0.3 | 1.2 | 2.1 | 3.4 | 3.4 | 600 | 600 | Kasper et al. 2011 |
| 38.3 | 6.5 | 1.0 | 1.3 | 3.1 | 1.0 | 1.7 | 1000 | 600 | Kasper et al. 2011 |
| 37.8 | 4.9 | 0.6 | 1.2 | 2.6 | 1.8 | 2.5 | 900 | 500 | Kasper et al. 2011 |
| 39.9 | – | – | – | – | 0.5 | 0.4 | 1 | 1 | Jing-ying et al. 2012 |
| 24.2 | 0.2 | 3.3 | 0.9 | 1.4 | 0.1 | 0.3 | 600 | 1000 | Ortuño et al. 2013 |
| 24.2 | 0.2 | 3.3 | 0.9 | 1.4 | 0.1 | 0.3 | 600 | 600 | Median value |